GC0307-P GC0309-P Camera IC Test Socket Flip Cover Chip Fixture

GC0307-P GC0309-P Camera IC Test Socket Flip Cover Chip FixtureCommunication interface GC0307 P GC0309 P camera chip test socket with Gold Plated probe and flip cover design, it's mainly used for motherboard sensor testing, Such as GALAXYCORE, BYD, Micron (aptina), Samsung, MagnaChip, OV, SiliconFile, SET, Stmicro, PixelPlus, Philips, SuperPix, Pixart and other brands. The communication interface GC0307 P GC0309 P camera chip test socket features a gold plated probe and flip cover design and is mainly used for

Communication interface GC0307-P/GC0309-P camera chip test socket with Gold-Plated probe and flip cover design, it's mainly used for motherboard sensor testing, Such as GALAXYCORE, BYD, Micron (aptina), Samsung, MagnaChip, OV, SiliconFile, SET, Stmicro, PixelPlus, Philips, SuperPix, Pixart and other brands.

The communication interface GC0307-P/GC0309-P camera chip test socket features a gold-plated probe and flip cover design and is mainly used for motherboard sensor testing such as GALAXYCORE, BYD, Micron (Aptina), Samsung, Magna Chips, OV, Silicon Fiber, SET, Stemekro, Pixel Plus, Philips, SuperPix, Pixel and other brands.

Features:
1. Socket head with manual flip structure, sensitive operation.
2. The chip press block of the top cover of the socket is user-friendly, the pressure down smoothly, to ensure uniform pressure IC, not offset.
3. The pawl protrusion of the probe can effectively pierce the oxide layer of the solder ball, the contact performance is stable, and protects the shape of the solder ball.
4. Rational positioning of the groove, the guide hole can determine the IC positioning accuracy.
5. Special IC carrier board structure, protection of the probe from external damage.
6. Probe: imported probe, beryllium copper plated hard gold, rhodium.
7. Low maintenance costs: easy to replace the probe, the cost of high efficiency.
8. Mature processing accuracy range: jump pitch= 0.4mm.

Chip applications: Mobile phone camera, computer camera test frame, PCBA maintenance, incoming inspection (IPQC), chip screening, project validation, ect.